氯化钠盐粒覆盖下铜的腐蚀行为  

Corrosion Behavior of Copper Covered with Sodium Chloride Powders

作　　者：程庆利[1,2] 侯保荣[1] 

机构地区：[1]中国科学院海洋研究所,山东青岛266071 [2]中国科学院大学,北京100049

出　　处：《材料保护》2013年第12期20-23,7,共4页Materials Protection

摘　　要：通过失重法和电化学阻抗谱技术,研究铜表面NaCl盐粒分别沉降70,280,560μg/cm2时的腐蚀行为。结果表明:铜的腐蚀速度随着盐粒沉降量的增加而增大,起始1 h时内腐蚀过程受氧扩散控制的影响,腐蚀速度大小顺序为560μg/cm2>70μg/cm2>280μg/cm2;72 h时,由于电极表面腐蚀产物和残余电解液膜的影响,其腐蚀速度大小为70μg/cm2>560μg/cm2>280μg/cm2;在整个腐蚀阶段,电流不均匀地分布在电极表面,当NaCl在盐粒沉降量为280,560μg/cm2时,其阻抗谱符合传输线模型。The corrosion behavior of copper covered with 70 μg / cm2,280 μg/cm2 and 560 μg / cm2NaCl powders was investigated by weight loss method and electrochemical impedance spectroscopy(EIS).Results showed that the corrosion rate of Cu increased with increasing sediment amount of NaCl.In the first 1 h,the corrosion rate was ranked as 560 μg / cm2> 70 μg / cm2> 280 μg / cm2,where the corrosion process was controlled by the diffusion of oxygen.At the later stage(72 h),due to the formation of the corrosion products and the presence of residual electrolyte on the copper surface,the corrosion rate of Cu was ranked as 70 μg / cm2> 560 μg /cm2> 280 μg / cm2.In the whole corrosion stage,the distribution of current density was uneven on the electrode.Particularly,the impedance spectra of Cu at NaCl sediment dosages of 280 μg /cm2and 560 μg / cm2could be interpreted with the transmission line theory.

关 键 词：氯化钠腐蚀 铜 腐蚀速率 盐粒沉降 阻抗谱 

分 类 号：TG172.3[金属学及工艺—金属表面处理]