基于树脂包封的微波三维多芯片组件技术研究  

A Study on Microwave 3D-MCMs Techniques Using Epoxy Resin Encapsulation

作　　者：张兆华[1] 吴金财[1] 王锋[1] 

机构地区：[1]南京电子技术研究所,南京210039

出　　处：《现代雷达》2013年第12期64-67,共4页Modern Radar

摘　　要：深入分析了环氧树脂在微波频段与陶瓷单层电路进行叠层包封的可行性,研究了环氧树脂基叠层工艺对微波传输性能的影响,针对环氧树脂包封的三维模块提出了类共面波导结构的侧边垂直过渡技术,并设计了三维低噪声放大器模块来验证其在X波段工作的可行性,分析了树脂包封三维模块设计中存在的接地问题及腔体谐振问题,给出了一些解决方法。The feasibility of epoxy resin encapsulated package for ceramic thin film circuits in microwave band is analyzed. The im- pact of epoxy resin stacked package for microwave transmission line is presented. Then, the vertical transition which is similar to the CPW transmission line is also proposed for epoxy resin package. Meanwhile, a X-band three dimensional low noise amplifier was designed to verify the feasibility of the interconnection. Finally, grounding problem and cavity effect of the three dimensional module were analyzed and some solutions for these problems were given.

关 键 词：树脂包封 微波多芯片组件 垂直过渡 三维低噪声放大器 

分 类 号：TN409[电子电信—微电子学与固体电子学]