喷墨打印用超支化聚酯阻焊剂的制备与表征  

Preparation and characterization of hyperbranched polyester-based solder resist for inkjet printing

作　　者：杨超[1] 杨振国[1] 

机构地区：[1]复旦大学材料科学系,上海200433

出　　处：《印制电路信息》2013年第12期18-21,共4页Printed Circuit Information

摘　　要：喷墨打印阻焊剂自研发以来,因树脂油墨剪切变稀和触变性等特点,一直不能有效解决阻焊剂喷墨初始阶段稳定性问题。对此,本研究以Boltorn H20为原料,合成了一种超支化丙烯酸化合物,在与TMP3EOTA及UV固化剂混合后,可以获得稳定性好的阻焊油墨,在光源照度1 w/cm2条件下固化速度低于20 s,固化膜的热分解温度超过300℃,阻焊膜的其他性能符合IPC-SM-840C和CPCA 4306-2011等相关标准。As printable solder resist has been researched recently, the solder mask prepared by ink-jet printing technology shows unstable properties and uneven linewidth due to resins possess shear-thinning nature and thixotropy. A novel hyperbranched acrylate polyester resin was synthesized with Boltorn H20. The resin was mixed with TMP3EOTA and UV curing agent to prepare solder resist ink. The ink was cured under 1 w/cm2 UV light source and the duration of curing was less than 20s. The cured mask was degraded over the temperature of 300℃ and also satisfied the standard of IPC-SM-840C and CPCA 4306-2011.

关 键 词：喷墨打印 阻焊剂 超支化树脂 低黏度 

分 类 号：TN41[电子电信—微电子学与固体电子学]