微波组件Al-Si封装材料表面改性工艺研究  

Study on Surface Treatment Method of Micro-Wave Component Al-Si Packaging Material

作　　者：刘东光[1] 卢海燕[1] 周明智[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230088

出　　处：《雷达科学与技术》2013年第6期675-678,共4页Radar Science and Technology

摘　　要：对高硅铝合金进行表面改性工艺实验,工艺分步实施化学镀镍、电镀镍、电镀金步骤,得到的镀层表面光滑平整,没有明显的结瘤和夹杂,镀层经高温烘烤无起泡脱落现象,与对应的铅锡焊料具有良好的焊接性和焊接速度,焊接后长期放置不出现晶须。该工艺作为高硅铝合金可焊性表面处理技术之一,兼具可选择区域镀、可接触导通、良好的键合性能,能兼容各种助焊剂,对于铝基复合材料表面处理具有十分重要意义。The surface treatment method of silicon aluminum alloy that can be used for electronics pack- aging is studied. The Ni-Au multilayer coatings were produced by electroless plating and plating methods, and continuous and well adhered coatings have been developed. Investigated results indicated the surface of film is smooth, and no gold coating spilled over after high temperature roast. The new surface treatment process can be used as one of the weld surface treatment technology on high silicon aluminum alloy. It also can he used for selective area plating, which has contact conductive, good bonding performance, and good compatibility with various solder. This technology has the significance for the aluminum composite material.

关 键 词：高硅铝合金 表面 焊接 镀层 

分 类 号：TN305.2[电子电信—物理电子学]