基于工艺层富胶模压结构的绝缘均匀性处理  

Dealing With Insulation Uniformity Based on Structure of Process Layer Rich Glue Molded

作　　者：弓锵[1] 刘艳芳[1] 

机构地区：[1]运城学院,山西运城044000

出　　处：《微电机》2013年第12期78-80,共3页Micromotors

摘　　要：工艺层富胶模压结构是在富胶模压结构绝缘层以外,增加一层工艺热缩层。通过绝缘层外观的变化及散热效果的不同研究了工艺层富胶模压结构的原理和具体工艺过程。实验表明:通过工艺层收缩对绝缘层产生的压力,可以使富胶绝缘胶化时生成的绝缘胶均匀分布,提高绝缘的整体均匀性,有效解决胶层堆积现象,缓解因胶化产生的绝缘"发泡",改善绝缘层的散热。The structure of the process layer rich glue molded is adding a heatshrinkable process layer out side of the rich glue molded insulation layer. The principle and specific process of the process layer rich plastic molded structure during appearance changes and cooling effect was investigated. The results show that the pressure generated on the insulating layer with shrinkage of the process layer, can make the insulation glue evenly distribute, improve the insulation overall uniformity, effectively solve the gluedeposition, relieve the insulation ＂bulging＂, and improve the insulation layer heart dissipation.

关 键 词：工艺层 富胶模压 绝缘均匀性 胶层堆积 发泡 

分 类 号：TM305.2[电气工程—电机]