化学复合镀纳米金刚石粉的研究  

A Study of Ni-P Nanometer Diamond Composite Electroless Plating

作　　者：相英伟[1] 张晋远[1] 金成海[1] 

机构地区：[1]钢铁研究总院,北京100081

出　　处：《材料工程》2000年第4期22-25,共4页Journal of Materials Engineering

基　　金：航空基金

摘　　要：研究了化学复合镀纳米金刚石粉的不同施镀工艺 ,并分析了复合镀层的性能和结构。结果显示 ,与机械搅拌和氮气搅拌相比 ,注射搅拌制得的复合镀层中的纳米金刚石含量较高。实验中选用的几种表面活性剂未能提高复合镀层中纳米金刚石的复合量。纳米金刚石的嵌入不改变复合镀层的结构 ,但使镀层表面形成不平整的、微小球粒堆砌状形貌。WT10.BZ]The process of NiP nanometer diamond composite electroless plating was studied The structure and hardness of the composite coating were analysed The results show that the composite coating prepared with injection agitation has a larger nanometer diamond content than that with mechanical agitation and N_2 agitation Several surfactants used in this test fail in increasing nanometer diamond content of the composite coating The embedded nanometer diamond particles don′t change the structure of NiP matrix, but coarsen the surface of the composite coating with a large number of spherical particles

关 键 词：化学复合镀 纳粹金刚石 表面活性剂 镀层结构 

分 类 号：TQ153[化学工程—电化学工业] TB383[一般工业技术—材料科学与工程]