基于Moldflow的座机电话外壳成型仿真分析  

The Simulation Analasys of Telephone Shell Based on Moldflow

作　　者：刘玲[1] 来彦玲[1] 

机构地区：[1]安阳工学院机械工程学院,河南安阳455000

出　　处：《安阳工学院学报》2013年第6期10-12,共3页Journal of Anyang Institute of Technology

摘　　要：为提高模具设计的效率,降低模具制造的成本,以电话座机外壳为研究对象,利用Moldflow MPI 6.0系统对制件进行流动-冷却-翘曲分析,得出最佳浇口位置、填充时间、冷却水道温度、翘曲变形等的分析结果,根据分析结果给模具设计工作提出宝贵的建议,设计出可靠的模具。In order to improve the efficiency of mold design, reduce costs of mold manufacturing, we used Moldtlow MPI 6 to the telephone shell flow cooling and warpage analysis, which was taken as the research object, obtained the best gate location, the filling time, cooling water temperature, warpage analysis results, according to the results of analysis ,we can get valuable advice for die design work, and design a reliable mold.

关 键 词：冷却 翘曲 MOLDFLOW 电话座机外壳 

分 类 号：TQ320.66[化学工程—合成树脂塑料工业]