封装体叠层中堆叠焊球的可靠性研究  

Reliability study of TMV stack solder joints in PoP package

作　　者：张旻澍[1] 宋复斌 

机构地区：[1]厦门理工学院材料科学与工程学院,福建厦门361024 [2]天弘科技有限公司,广东东莞523808

出　　处：《电子元件与材料》2014年第1期63-66,共4页Electronic Components And Materials

基　　金：国家自然科学基金资助项目(No.11204258);福建省自然科学基金资助项目(No.2012J05100);厦门市科技计划项目资助(No.3502Z20123040)

摘　　要：针对封装体叠层中的堆叠焊球进行了有限元建模和应力分析,评估了TMV堆叠焊球这种新型焊接方式可能带来的可靠性隐患。通过仿真结果发现,堆叠焊球的应力集中比底部焊球更加严重,这说明热疲劳失效更容易发生在塑封胶穿孔中的堆叠焊球上,而原本针对底部焊球的可靠性测试标准则需要做出新的调整。此外,在两种不同的堆叠焊球成型中,雪人式焊球的应力集中比较水桶状焊球更加严重。通过参数研究可以发现,紧缩区域的宽窄程度是造成雪人式焊球应力集中的关键因素。The finite element method and related stress analyses were used to evaluate the TMV（through molding via） stack solder joints＇ reliability in PoP（package on package） package. The simulation results show that the stress concentration in TMV solder points is more aggressive than that in bottom package solder points. It means the thermal fatigue failure easily occurs at TMV stack solder points in holes of plastic sealants. It also means the traditional reliability test based on the bottom package solder points is no longer suitable. Besides, by using the parameters research, it is found that the snowman solder joints are more dangerous than bucket solder points and its necking width is the key to affect the stress concentration.

关 键 词：TMV堆叠焊球 可靠性 封装体叠层 有限元建模 热翘曲 应力集中 

分 类 号：TG42[金属学及工艺—焊接]