综合模块化航空电子设备结构设计浅谈  

Discussion on Structural Design of Integrated Modularization Avionic Equipment

作　　者：黄诚[1] 

机构地区：[1]中国电子科技集团公司第十研究所,四川成都610036

出　　处：《电子机械工程》2013年第6期27-29,35,共4页Electro-Mechanical Engineering

摘　　要：在综合化航空电子技术高速发展的背景下,基于资源的高效利用和系统可重构的要求,航空电子设备向综合模块化形式发展。这类设备拥有集成度高、发热量大、冲振环境恶劣和结构复杂等特点。文中依据长期的综合模块化航空电子设备结构设计经验,同时结合工程实例,对该类设备的结构设计进行论述,主要包含LRM模块标准和安装接口要素、机箱结构分区及功能定义、设备散热形式选择和设计、减振安装和硬振安装的特点分析,形成了综合模块化航空电子设备结构设计的主体框架,对相关设计具有一定参考价值。With the fast development of integrated avionic technology, the avionics develops to the direction of inte- grated modularization to meet the requests of eflqcient resources usage and system reconfiguration. Avionics features high integration, high heat dissipation, bad shock and vibration environment and complex structure. Based on the long term experience of structure design of integrated modularization avionics, considering project instance at the same time, the structure design of this type equipment is discussed in this paper. Main aspects include LRM module standard and assembly interface essentials , cabinet partition and function definition , heat dissipation method design , characteristic analysis for assembly with vibration isolator and direct assembly. The main idea of the structural design of integrated modularization avionics is obtained, which provides some reference value for relevant design.

关 键 词：综合模块化 航空电子 结构设计 热设计 抗冲振设计 

分 类 号：V241.03[航空宇航科学与技术—飞行器设计]