大热流密度电子设备的散热方法  

Cooling Measures of High Flux Electronic Equipment

作　　者：季爱林 钟剑锋[1,3] 帅立国[2] 

机构地区：[1]南京电子技术研究所,江苏南京210039 [2]东南大学,江苏南京211189 [3]天线与微波技术国防科技重点实验室,江苏南京210039

出　　处：《电子机械工程》2013年第6期30-35,共6页Electro-Mechanical Engineering

基　　金：国防基础科研重点项目(JCKY2013210B004)

摘　　要：随着当代电子技术的高速发展,电子产品的热流密度急剧升高,过高的温度对电子设备正常工作的影响也越来越严重,大热流密度对电子设备的冷却技术提出了更高的要求。文中针对大热流密度电子设备的散热方法,重点介绍了强迫空气冷却、热管、微槽道等现有的散热方法的工作原理、应用方式以及应用场合,并结合相关文献简要介绍了气体喷射冷却、喷雾冷却和热电制冷等新型散热方法在大热流密度电子设备中的应用发展状况。With the fast development of the electronic technology, the flux of electronic products becomes higher and higher. And the effect of high temperature on normal work of the electronic equipment is becoming more and more serious. Higher requirements for cooling technology for the electronic equipment are necessary due to high heat flux. This paper introduces in detail the operation principle and applications of some high per- formance cooling measures such as forced air cooling, heat pipe and micro channel cooling. Combined with the related literature, this paper also briefly introduces the application of new cooling methods such as the gas jet cooling, spray cooling and thermoelectric refrigeration to electronic equipment with high heat flux.

关 键 词：大热流密度 强迫风冷 热管 微通道冷板 喷雾冷却 

分 类 号：TN305.94[电子电信—物理电子学]