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机构地区:[1]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001
出 处:《材料工程》2013年第12期44-48,共5页Journal of Materials Engineering
基 金:国家自然科学基金资助项目(51075101)
摘 要:采用TiZrNiCu非晶活性钎料进行ZrB2-SiC复合陶瓷的真空钎焊连接,通过电子扫描显微镜、能谱分析仪及X射线衍射分析仪,分析钎焊过程接头界面反应产物,阐述产物形成机理。利用扩散理论,结合Ti元素在固溶体层的扩散行为,对界面中复合材料侧形成的Zr(s,s)固溶体层进行动力学分析,得到了描述Zr(s,s)固溶体层生长行为的动力学方程。The ZrB2-SiC (ZS) ceramic composite was brazed in vacuum using TiZrNiCu amorphous ac- tive filler. Combined with the brazing process in each stage, the interracial reaction product and the forming mechanism were analyzed by SEM, EDS and XRD. Ti atom is the most active element in the filler metal. Its reaction product distributes along the joint, which having significant effect on micro- structure and mechanical property of the joint. Based on diffusion theory and the diffusion of Ti atom in the solid solution layer, the growth behavior of the Zr(s,s) solid solution layer is discribed and the dynamic equations for growth behavior of zirconia solid solution layer are obtained.
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