基于FIB-SID技术的三维金属无源电感制备与测试  

Fabrication and Testing of 3D Metal Passive Inductor Based on FIB-SID Technology

作　　者：毛逸飞 王志强[1,2] 赵路睿 吴文刚[1] 徐军[3] 

机构地区：[1]北京大学微米/纳米加工技术国家重点实验室,北京100871 [2]北京大学深圳研究院,广州深圳518000 [3]北京大学电子显微镜实验室,北京100871

出　　处：《中国材料进展》2013年第12期742-745,751,共5页Materials China

基　　金：国家级先进制造预研项目;国家自然科学基金项目(50775001);国家"863计划"专题课题(2009AA01Z228)

摘　　要：重点研究了聚焦离子束的相关原理和应用。利用聚焦离子束应力引入致形变(Focused Ion Beam Stress-Introduced Deformation,FIB-SID)技术与常规微加工工艺相结合,制备微型金属无源螺旋电感的设计方法和工艺流程,并对其电学性能进行初步高频测试。首先在SOI(Silicon-on-Insulator)基片上通过光刻、溅射以及各项同性刻蚀等常规工艺制得悬浮的金属悬臂梁,再利用FIB刻蚀原理进行应力引入,通过控制注入离子剂量、FIB应力引入的次数、FIB扫描的间距等试验参数制得不同尺寸结构的三维螺旋金属无源电感。后,采用安捷伦网络分析仪与微波探针台,使用GSG结构及相应的去嵌方法,对微型金属螺线管电感进行了高频测试。得出了三维螺旋微纳电感的电感值、品质因子、电压驻波比、回波损耗随频率变化关系。The combination of Focused Ion Beam Stress-introduced Deformation （FIB-SID） and micro-fabrication tech-nology is focused on, and the fabrication process and test methods of metal passive micro-helix inductor are described. First of all, the suspended metal cantilever is made on SOl（Silicon-on-insulator） by photolithography, sputtering and iso-tropic etching. Then, the stress is introduced to fabricate 3D metal passive micro-helix inductor with different sizes by con-trolling ion dose, FIB stress introduced time, FIB scanning pitch. Finally, the metal passive micro-helix inductor is tested at high frequency with the help of Agilent network analyzers and microwave probe station using GSG test structure and de- embedding process. The relationship between the Inductance value, quality factor, voltage standing wave ratio, return loss of micro-helix inductors against frequency is obtained.

关 键 词：FIB—SID 微型金属无源螺旋电感 高频测试 

分 类 号：TN405[电子电信—微电子学与固体电子学]