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作 者:张莹娇[1] 陈姚[1] 于欣伟[1] 王步华[1] 秦中海[1] 蔡晓敏[1]
出 处:《电镀与涂饰》2014年第2期66-69,共4页Electroplating & Finishing
摘 要:以有机硅KH570为偶联剂,采用溶液聚合法,将其与硅溶胶同时加入到丙烯酸及其酯类单体的聚合过程中,利用有机硅的架桥作用将硅溶胶接枝到丙烯酸树脂分子上,得到稳定的硅溶胶/有机硅改性丙烯酸树脂复合材料(SSPA)。研究了有机硅种类及其用量、硅溶胶用量对SSPA性能的影响,通过红外光谱对其结构进行了表征,测试了改性前后丙烯酸树脂的粒径分布。结果表明,硅溶胶通过有机硅成功接枝到丙烯酸树脂分子上,最佳的制备工艺条件为硅溶胶添加量[m(SiO2)/m(单体)]为4%,m(KH570)/m(SiO2)=5%。用硅溶胶和有机硅改性后得到的SSPA平均粒径增大,分散性变好,涂膜的硬度、冲击强度和附着力等性能都有所提高。A stable silica sol/organic silicon modified acrylic resin composite (SSPA) was obtained by adding organic silicone KH570 as coupling agent and silica sol simultaneously to the mixture of acrylic acid and acrylate monomers during their solution polymerization process. The silica sol was grafted to acrylic acid molecules by the bridging effect of organic silicone. The effects of the type and dosage of organic silicone and the dosage of silica sol on the properties of SSPA were studied. The structure of SSPA was characterized by infrared spectroscopy. The particle size distribution of acrylic resin before and after modification were tested. It was found that the silica sol is successfully grafted to acrylic acid molecules via organic silicone. The optimal process conditions are as follows: amount of silica sol 4% (as mass ratio of SiO2 to monomers) and mass ratio of KH570 to SiO2 5%. The SSPA obtained by modification with silica sol and organic silicone has an increased average particle size and better dispersibility. The hardness, impact strength, and adhesion of the coating obtained from SSPA are improved.
分 类 号:TQ316.63[化学工程—高聚物工业]
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