摩擦辅助电铸铜的研究  

A Research on Friction Assisted Copper Electroforming

作　　者：徐营[1] 朱增伟[1] 彭永森[1] 任建华[1] 

机构地区：[1]南京航空航天大学机电学院,江苏南京210016

出　　处：《电镀与环保》2014年第1期16-19,共4页Electroplating & Pollution Control

基　　金：高等学校博士学科点专项科研基金(20093218120025);新世纪优秀人才支持计划资助(NCET-10-0074)

摘　　要：为了改善电铸铜的质量与机械性能、提高电铸速率,在传统硫酸盐电铸铜技术的基础上,将阴阳两极之间填充满陶瓷球类的硬质粒子。在电铸过程中,阴极做回转运动,硬质粒子在阴极的带动下不断撞击和摩擦阴极表面。研究发现:在硬质粒子的摩擦辅助作用下,该电铸工艺能够采用较大的电流密度,制备的电铸铜层表面平整;同时还能够改善电铸铜层的微观组织、细化晶粒。当电流密度为15A/dm2时,制备的电铸铜层的显微硬度能够达到1 720MPa,抗拉强度能够达到336MPa,分别约为传统电铸铜层的2倍和5倍。In order to improve the quality and mechanical properties of eleetroforming copper layer and to increase the electroforming rate, based on traditional sulfate copper electroforming technologies, hard particles similar to ceramic beads were filled between cathode and anode. In the process of electroforming, cathode made a rotational motion driving the hard particles continuously impact and rub against the cathode surface. It is found that higher current density can be used in this electroforming process, the surface of electroforming copper layer thus prepared is smooth; the microstructure of the electroformed copper can also be effectively improved, and the grains refined. When the current density is 15 A/dm2, the microhardness of the electroforming copper layer can reach 1 720 MPa, and the tensile strength can be up to 336 MPa, which are about two times and five times respectively of those of the copper electroforming layers prepared by traditional methods.

关 键 词：电铸铜 硬质粒子 摩擦 电流密度 

分 类 号：TQ153.4[化学工程—电化学工业]