网状聚氨酯泡沫化学镀镍工艺的研究  

A Study of Electroless Ni Plating on Reticulated Polyurethane Foam

作　　者：司倩倩[1] 陈厚和[1] 张幺玄[1] 王雄彪[1] 刘艳君[1] 江金金[1] 

机构地区：[1]南京理工大学化工学院,江苏南京210094

出　　处：《电镀与环保》2014年第1期29-32,共4页Electroplating & Pollution Control

摘　　要：研究了前处理过程中粗化对镀层质量的影响,以及化学镀镍过程中硫酸镍、次磷酸钠、氯化铵、柠檬酸钠和温度等工艺条件对镀层的沉积速率和电阻率的影响。经优化的网状聚氨酯泡沫化学镀镍的最佳工艺条件为:硫酸镍35g/L,次磷酸钠15g/L,氯化铵60g/L,柠檬酸钠20g/L,温度45℃。结果表明:镀镍后大大提高了网状聚氨酯泡沫的导电性,且镀层均匀、结合牢固。The effects of roughening in the process of pretreatment on coating quality were studied and the effects of NiSO4, NaH2PO2, NH4Cl, Na3C6H5O7 concentration, plating temperature and other technological conditions on coating deposition rate and resistivity during electroless nickel plating were also investigated. The optimal process conditions of the electroless Ni plating on reticulated polyurethane foam are as follows： NiSO4 35 g/L, NaH2PO2 15 g/L, NH4Cl 60 g/L, Na3C6 H5O7 20 g/L, plating temperature 45℃. The results show that the electric conductivity of the nickel plated reticulated polyurethane foam increases greatly, and the obtained Ni film is uniform and has a strong adhesion.

关 键 词：网状聚氨酯泡沫 化学镀镍 沉积速率 电阻率 

分 类 号：TQ153[化学工程—电化学工业]