一种制造印制电路板的加成法新工艺  

A new kind of additive process for fabricating Printed Circuit Board

作　　者：常煜[1] 杨振国[1] 

机构地区：[1]复旦大学材料科学系,上海200433

出　　处：《印制电路信息》2014年第1期12-15,共4页Printed Circuit Information

摘　　要：研发了一种制备印制电路板(PCB)的印刷、吸附、催化加成法工艺。该工艺结合了印刷技术与化学镀技术,通过印刷离子吸附油墨形成线路图形、吸附催化离子、化学镀铜使线路金属化等工艺,可以低污染、无浪费的制备电性能和粘附力均优良的导电线路,基板选择范围广,可以直接制备单面和双面PCB,故是一种有应用前景的制备PCB的加成法新技术。An additive process, named patterning-adsorption-plating, to fabricate printed circuit board （PCB） was developed. The developed process combines printing with electroless plating and involves several processing steps such as printing of ion-adsorption ink, adsorption of catalytic ion and metallization of patterns by electroless plating. This allows to obtain high conductive, adhesive patterns of double-sided PCB with lower pollution to environment and no waste of material. It is so considered as a new additive process to fabricate PCB with high potential application.

关 键 词：PCB 加成法 印刷 离子吸附 化学镀 

分 类 号：TN41[电子电信—微电子学与固体电子学]