纳米二氧化硅对热熔压敏胶的改性研究  

Study on hot melt pressure sensitive adhesive modified by nano-SiO_2

作　　者：刘延昌[1] 林芳芹[1] 李光鹏 汪济奎[1] 

机构地区：[1]华东理工大学,上海200237 [2]浙江固特热熔胶有限公司,浙江桐乡314512

出　　处：《中国胶粘剂》2014年第1期35-37,共3页China Adhesives

基　　金：国家科技支撑计划项目(2012BAD32B00)

摘　　要：针对HMPSA(热熔压敏胶)普遍存在的耐热性较差等问题,以SIS(苯乙烯-异戊二烯-苯乙烯嵌段共聚物)为基体树脂,C5石油树脂、C9石油树脂及萜烯树脂为复合增黏树脂,nano-SiO2(纳米二氧化硅)为耐热改性剂,制备相应的HMPSA。研究结果表明:在其他条件保持不变的前提下,随着nano-SiO2含量的不断增加,HMPSA的初粘力和180°剥离强度均呈先升后降态势;当w(nano-SiO2)=2%(相对于SIS质量而言)时,HMPSA的软化点提高了15℃左右,其综合粘接性能相对最好[持粘力>72 h、初粘力(16#钢球)相对最大且剥离强度(39.4 N/cm)相对较大]。In allusion to generally poor heat resistance problems of HMPSA （hot melt pressure sensitive adhesive）, with SIS（styrene - isoprene - styrene block copolymer） as matrix resin, C5 petroleum resin, C9 petroleum resin and terpene resin as composite tackifying resin, nano-Si02 （nano silicon dioxide） as modifier of heat resistance, the according HMPSA was prepared. The research results showed that the HMPSA＇ s initial tack and 180~ peeling strength had all trends of raise-fall with increasing nano-Si02 contents when other conditions were unchanged. The HMPSA＇ s softening point was raised about 15 ~C, and its combination properties in bonding were relatively best because holding tack was more than 72 h, initial tack （16# steel ball） was relatively maximal, and peeling strength（39.4 N/cm） was relatively larger when mass fraction of nano-Si02 was 2% in SIS.

关 键 词：热熔压敏胶 纳米二氧化硅 耐热性 软化点 

分 类 号：TQ436.3[化学工程]