光纤光栅传感器高温粘接失效机理实验  

Experiment of Failure Mechanism of High Temperature Bonded Fiber Grating Sensor

作　　者：杜翀[1] 彭焘[1] 霍施宇[1] 解维华[1] 孟松鹤[1] 

机构地区：[1]哈尔滨工业大学复合材料与结构研究所,哈尔滨150080

出　　处：《上海大学学报（自然科学版）》2013年第6期551-555,共5页Journal of Shanghai University:Natural Science Edition

基　　金：国家自然科学基金资助项目(11272107;91016029;91216302)

摘　　要：随着耐受温度的不断提高,高温光纤光栅在高温热结构领域的应用潜力愈发明显.高温粘接是一种实现光纤光栅传感器应用的最简单有效的方法,但高温环境使得高温粘接存在多种失效的可能.通过高温拉伸和剪切实验研究了光纤光栅传感器与超高温陶瓷粘接的粘接性能,结合断口的宏微观形貌观察研究了高温粘接的失效机理.研究结果表明:当温度为500和650℃时,粘接破坏是包含界面破坏和粘接剂内聚力破坏的混合破坏模式,并且以粘接剂内聚力破坏为主;在800和1 000℃环境下,粘接失效主要是缘于界面破坏.在热和力的共同作用下,粘接剂内部的孔洞逐渐扩展为裂纹,导致抗拉强度减弱,而单纯的高温热处理却会提高粘接性能.As the temperature resistance of fiber grating improving, the potential application of the fiber grating sensor in the high temperature thermal structure field is increasingly apparent. The high temperature bonding method is one of the most simple and effective methods to apply fiber grating sensors. However, the high temperature environment may cause various high temperature adhesive failures. The bonding properties of fiber grating sensor and ultra high temperature ceramic are studied in high temperature tensile and shear experiments, and the high temperature bonding failure mechanisms are studied by macro and micro fracture morphology observations. The results show that the bonding failure is a mixed failure mode including interface damage and cohesive failure at two temperatures 500 and 650 ℃, and mainly adhesive cohesive failure, while at 650 and 800 ℃, bonding failure is mainly interface failure. Under a thermal and mechanical load, holes in the adhesive gradually develop to the crack weakening tensile strength, and simple high temperature heat treatment can improve the bonding performance.

关 键 词：高温光纤光栅传感器 高温粘接 超高温陶瓷 失效机理 

分 类 号：O346.4[理学—固体力学]