食品级超薄电镀锡基板生产工艺优化  

Production Technology Optimization of Food Grade Ultra-thin Electroplating Tin Substrate

作　　者：任来锁[1] 侯元新 李传军[1] 赵志刚 

机构地区：[1]山东泰山钢铁集团有限公司,山东莱芜271100 [2]莱芜市建委节约用水办公室,山东莱芜271199

出　　处：《山东冶金》2013年第6期10-13,16,共5页Shandong Metallurgy

摘　　要：根据食品级超薄电镀锡基板质量要求，通过优化酸洗工艺参数，乳化液理化指标，碱液、电解液的温度、浓度和漂洗水的电导率，提高了产品的表面质量；通过研究HC六辊轧机中间辊横移位置与板形的对应关系，调整工作辊的弯辊量，提高了产品的板形质量；采用全氢强循环光亮罩式退火技术，通过优化退火工艺，保证了产品的物理性能。泰钢成功开发出了食品级超薄电镀锡基板，产品达到了高级表面精度（FC），不平度在2mm以下，宽度偏差在0～3mm以内，厚度偏差在-0．02～0mm以内，硬度达到了T3要求。According to the quality requirements of food grade ultra-thin electroplating tin substrates, by optimizing the pickling parameters, physioehemical index of emulsion, the temperature and concentration of alkali liquor and electrolyte and the conductivity of rinsing water, the surface quality of the products was improved. By studying the relationship between the traversing positions of intermediate roll of HC six-rail mill and the shape and adjusting the amount of work roll bending roll, the shape quality was improved. All-hydrogen strong cyclic bright batch annealing technology was adopted and by optimizing the annealing process, the physical properties were insured. Therefore, Taishan Steel successfully developed the food grade ultra-thin electroplating tin substrates. The products have high surface precision （FC）, the unevenness is less than 2 mm, the deviation of width is within 0-3 mm, the deviation of thickness is within -0.02-0 mm and the hardness meets the T3 requirements.

关 键 词：超薄电镀锡基板 产品开发 表面质量 板形 性能 

分 类 号：TG335.55[金属学及工艺—金属压力加工]