基于阵列电极的电沉积铜层均匀度研究  

Uniformity of electroplating copper layer based on electrode arrays

作　　者：张锦秋[1] 陈桂林[1] 王晓伟[1] 

机构地区：[1]哈尔滨工业大学化工学院,哈尔滨150001

出　　处：《中国科技论文》2013年第12期1225-1227,共3页China Sciencepaper

基　　金：高等学校博士学科点专项科研基金资助项目(20112302120035)

摘　　要：为解决微小、复杂零件电镀时存在的电流密度分布不均匀的问题,在固定尺寸的电镀槽内,使用工作面积不同和排列位置不同的阵列玻碳电极作为阴极,模拟多个微小零件,通过测试阴极极化曲线和恒电位沉积-溶出实验,研究镀铜液静止和流动时对阴极电流密度分布影响。研究发现:电极工作面积增大,极限扩散电流密度减小;搅拌镀液并不能使工作面积不同的电极电流密度分布平均化;电极呈等边三角型排布时电流密度平均分布情况最好。In the electrodeposition process of small and complex-shaped workpieces, current density is not uniform on different ca- thodic parts. Glassy carbon electrode arrays with different sizes and arrangements that simulate some small workpieces were used as the cathodes. Under the conditions of static and flowing solutions at a stationary size of a tank, the current density distribution was studied by measurement of linear sweep voltammetry and test of constant-potential electrodeposition and dissolution. The re- suits showed that with the electrode working area increasing, the limiting diffusion current density decreased. Agitation on solu- tion was not effective to get uniform current density distribution on the electrodes with different working areas. The optimal uni formity of current density distribution was obtained when the electrodes were arranged at equilateral triangle vertices.

关 键 词：应用化学 电极 电流密度分布 

分 类 号：TQ153.1[化学工程—电化学工业]