Ni对SnAgCuRE钎料钎焊接头性能的影响  

Effects of Ni on Properties of Brazed Joints by SnAgCuRE Solder

作　　者：樊艳丽[1] 

机构地区：[1]重庆工业职业技术学院车辆工程学院,重庆40112

出　　处：《热加工工艺》2014年第1期208-210,共3页Hot Working Technology

摘　　要：研究了Ni含量对SnAgCuRE/Cu钎焊接头金属间化合物(IMC)、剪切强度和蠕变断裂寿命的影响。结果表明:微量Ni能抑制钎焊接头界面区IMC的生长,减小IMC的尺寸,降低界面粗糙度,提高钎焊接头的力学性能。当Ni添加量为0.05%时,界面区IMC厚度减小且趋于平整,对应钎焊接头的剪切强度最大、蠕变断裂寿命最长。The effects of Ni on intermetallic compounds （IMC） and mechanical properties of SnAgCuRE/Cu solder joint have been examined. The results indicate that addition tiny Ni can suppress the growth oflMC at the interface of joints, reduce the roughness of interfacial layer and improve the mechanical properties of solder joint. The interracial IMC is thin and flat, the shear strength is highest and the creep rupture life is longest with 0.05%Ni in solder alloy.

关 键 词：SnAgCuRExNi Cu钎焊接头 金属间化合物 剪切强度 蠕变断裂寿命 

分 类 号：TG425[金属学及工艺—焊接]