纳米和微米Al_2O_3混杂颗粒增强弥散铜组织和热变形行为  

Microstructure and hot deformation behavior of nano and micron hybrid Al_2O_3 particles dispersion strengthened copper base composites

作　　者：杨雪瑞[1] 田保红[1,2] 张毅[1,2] 刘勇[1,2] 李全安[1] 任凤章[1,2] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471023 [2]河南省有色金属材料科学与加工技术重点实验室,河南洛阳471023

出　　处：《材料热处理学报》2014年第1期1-5,共5页Transactions of Materials and Heat Treatment

基　　金：国家和自然科学基金(51101052);河南省高校科技创新团队支持计划(2012IRTSHN008)

摘　　要：采用真空热压内氧化法制备纳米和微米Al2O3颗粒混杂增强弥散铜-Al2O3复合材料，对比研究了弥散铜和混杂增强弥散铜-0．9％Al2O3复合材料的密度、硬度、导电率和微观组织，采用Gleeble-1500D热模拟机的等温压缩实验探讨了两种弥散铜复合材料的热变形行为。结果表明，弥散铜-0．9％Al2O3复合材料基体内同时存在内氧化产生的纳米级Al2O3颗粒及机械添加的微米级Al2O3颗粒，烧结态致密度均大于97．7％，硬度158—176HV，导电率60％IACS以上。两种复合材料变形温度600～950℃，应变速率0．001—1s-1条件下的真应力-应变曲线具有典型的动态再结晶特征，真应力随应变量增加均先增大后减小，之后达到-个稳定状态。热变形过程中热激活能随少量Al2O3添加而明显增加，建立了其稳态真应力-真应变双曲正弦本构方程。The nano and micron hybrid Al2O3 dispersion strengthened copper （ODSC） base cmnposites were prepared by vacuum hot-press sintcring and internal oxidation method. Compared with nano Al2O3 dispersion strengthened copper, the relative density, hardness and electrical conductivity and microstructure of ODSC composites were investigated, respectively. The hot deformation behaviors of the composites were carried out by a Gleeble-1500D thermal simulator with isothernml compression test. The results show that the nano Al2O3 particles produced by internal oxidation and the micron Al2O3 particles added by mechanical mixing are coexisted in the copper matrix of the ODSC-0. 9% A1203 composite. The relative density of the ODSC composites is more than 97.7% , microhardness is 158 - 776 HV and electrical conductivity is more than 60% IACS. The results show that the flow stress-strain curves of the ODSC composites have typical dynamic reerystallization characteristics under the compression conditions from 600 ℃ to 950 ℃ and strain rates from 0. 001 s -1 to 1 s With increasing strain, the true stress increases first and then decreases, after reaching a stable condition. The hyperbolic sine constitutive equations of the steady flow stress for the composites are established respectively.

关 键 词：混杂增强 弥散铜 动态再结晶 本构方程 

分 类 号：TG146.1[一般工业技术—材料科学与工程]