电流对Al/Cd偶液-液界面及凝固组织的影响  

Effect of electric current on the liquid-liquid interface and the solidified microstructure of Al / Cd couple

作　　者：徐前刚[1] 王士付[1] 李明佳[1] 

机构地区：[1]沈阳航空航天大学材料科学与工程学院,沈阳110136

出　　处：《沈阳航空航天大学学报》2013年第6期62-66,共5页Journal of Shenyang Aerospace University

基　　金：国家自然科学基金(项目编号:50704001)

摘　　要：以Al/Cd液/液偶为研究对象,研究了在700℃下电流对Al/Cd液/液偶界面熔合及凝固组织的影响。研究结果表明,未施加电流时凝固后界面附近铝基体中有颗粒状镉析出,镉基体中有颗粒状铝析出。随着保温时间的延长,界面附近铝基体和镉基体上析出颗粒状组织的量增加,颗粒尺寸增大。施加电流促进了Al/Cd液/液界面区域的熔合,凝固后界面附近铝基体中析出颗粒状镉的尺寸和镉基体中析出颗粒状铝的尺寸与未施加电流相比较都有明显的增加。并且这些颗粒状组织的尺寸随着电流的增加而增大。The paper investigated the effect of electric current on the interfacial fusion and the solidified mi- crostructure of Al/Cd liquid-liquid couple at 700 ℃. The experimental results showed that some Cd particles precipitated in the Al base and some Al particles precipitated in the Cd base near the solidified interface of Al/Cd couple with no applied electric current. The amount of precipitated particles in AI base and Cd base near the solidified interface and the size of the precipitated particles increased with the holding time of Al/ Cd couple at 700°C Applied current in Al/Cd liquid-liquid couple promoted the interface fusion. The size of the precipitated Cd particles in AI base and the size of the precipitated Al particles in Cd base near the so- lidified interface of Al/Cd couple with applied current are obviously larger than those without applied cur- rent. The size of the mentioned precipitated particles increased with the applied electric current flow.

关 键 词：电流 AL Cd液 液偶 难混溶合金 界面 

分 类 号：TB31[一般工业技术—材料科学与工程]