超高压烧结法制备金刚石/铜复合材料的性能研究  

Performance Study on Diamond/Copper Composite Prepared by Ultrahigh Pressure Sintering

作　　者：刘秋香[1] 董桂霞[1] 陈惠 李尚劼 

机构地区：[1]河北联合大学材料科学与工程学院河北省无机非金属材料重点实验室,唐山063009 [2]深圳市海明润实业有限公司,深圳518126

出　　处：《材料导报》2013年第24期66-69,共4页Materials Reports

基　　金：中俄国际合作项目(2012DFR50350)

摘　　要：采用超高压烧结法制备了金刚石/铜复合材料。研究了烧结温度、烧结压力及保温时间等因素对复合材料成分、界面状态和热导率的影响。利用XRD、SEM及EDS分析了金刚石/铜复合材料的相组成、微观形貌及界面结合状态。通过拉曼光谱对金刚石/铜复合材料中金刚石的石墨化进行了研究,结果表明:金刚石体积分数为65%时,烧结温度在1300℃时致密度可达98.8%,热导率达到200W/(m·K)。金刚石体积分数为50%,随着保温时间的延长热导率有所增加,在1200℃保温10min,热导率可达240W/(m·K)。金刚石在超高压烧结中未发生石墨化。Diamond/copper composite with different diamond volume fraction were prepared by ultrahigh pres- sure sintering. The effects of sintering temperature, sintering pressure and sintering time on the component interface status and thermal conductivity of the composite material were investigated. The phase composition, morphology and interface state of diamond/copper composite were analyzed by XRD, SEM and EDS. The graphitization of diamond in the diamond/copper composite was investigated by Raman spectra The results showed that the density of diamond/ copper composite with 650//oo diamond volume fraction sintered at 1300 ~C can be achieved 98. 8~. At the same time, the thermal conductivity was 200 W/（m ~ K）. When the diamond volume fraction was 50%, thermal conductivity of the composite increased with the sintering time prolonged. And it can reach 240 W/（m ~ K） when it was sintered at 1200 ~C for 10 min. The diamond was not graphitized in the diamond/copper composite by ultrahigh pressure sinte- ring.

关 键 词：超高压烧结 金刚石/铜复合材料 热导率 

分 类 号：TQ164[化学工程—高温制品工业]