陶瓷基板及钎焊技术对LED散热性能的影响  

Influence of ceramic substrate and soldering join technology on thermal dissipation performance of LED

作　　者：钱斐[1] 傅仁利[1] 张鹏飞[1] 方军[1] 张宇[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,江苏南京210016

出　　处：《电子元件与材料》2014年第2期47-51,共5页Electronic Components And Materials

基　　金：广东省战略新兴产业核心技术攻关资助项目(No.2011A091103002)

摘　　要：提出了一种新型的板上芯片直装式(COB)散热基板与散热翅片的连接技术——钎焊技术,结合实验和热仿真对比分析了钎焊连接与传统的导热膏连接对LED封装结构散热性能的影响。研究结果表明,在相同的热载荷下钎焊连接的封装结构中基板与翅片的温差为3℃,而导热膏连接的却为4.5℃。计算机仿真结果显示,在60℃恒温热载荷下钎焊连接和导热膏连接的封装结构的温差分别为0.8℃和1.6℃,并且施加更大功率热载荷时,钎焊连接的LED封装结构温差增加趋势更小,钎焊连接可以有效提高大功率LED的散热性能。A new connection technology between COB heat dissipation substrate and fins was introduced, namely soldering join technology. Compared with traditional thermal glue connection technology, the influence of soldering join technology on thermal dissipation performance of LED was studied by the experiment and thermal simulation. The experimental results show that the temperature difference of packaging structure with soldering join is 3 ℃ and the temperature difference of packaging with thermal glue join is 4.5 ℃. At the heat load of 60 ℃, the same result is obtained by thermal simulation whose temperature differences of soldering joining and thermal glue joining are 0.8 ℃ and 1.6 ℃, respectively. When the heat load increases, the temperature difference of packaging structure with soldering join increases more slowly. The thermal dissipation performance of high power LED would be highly improved by the soldering join technology.

关 键 词：LED封装 COB基板 钎焊技术 热仿真 封装结构 散热性能 

分 类 号：TN312.8[电子电信—物理电子学]