数控印制电路板加速寿命试验与统计分析  

Accelerated life test and statistical analysis of numerical control PCB

作　　者：解传宁[1] 唐小琦[1] 金健[1] 张航军[1] 

机构地区：[1]华中科技大学机械科学与工程学院,湖北武汉430074

出　　处：《华中科技大学学报（自然科学版）》2013年第12期1-6,共6页Journal of Huazhong University of Science and Technology(Natural Science Edition)

基　　金：国家重大科技专项资助项目(2012ZX04001012);广东省部产学研重大专项资助项目(2012A090300012)

摘　　要：针对影响数控印制电路板寿命的温度应力和线路设计因素,通过对印制电路板进行失效分析,探讨印制电路板寿命与温度和导线间距的关系,进而从失效机理角度推导出数控印制电路板综合应力作用下的加速寿命试验参数模型.基于统计检验方法,利用恒定双应力加速寿命试验数据,对威布尔分布下双应力加速寿命试验数据进行统计分析.试验结果表明:建立的加速寿命模型能较好地描述数控印制电路板寿命特征在双应力作用下的变化规律,为数控系统可靠性增长奠定基础.The purpose of this study is explore the factors effecting the temperature and line design of a printed circuit board （PCB）. The relationship between the PCB lifetime and temperature and con- ductor spacing were analyzed through the failure analysis of numerical control （NC） finished boar,＆ Then from the point of the failure mechanism, the accelerated life model of NC PCB was built under the action of double stress. Finally, the data on double stress accelerated life test for Weibull distribu- tion were analyzed by the statistical methods of constant stress accelerated life test. The verification shows that the new parametric model for the accelerated life test can well describe the variation of the life characteristics of NC PCB under the action of double stress, laying the foundation of the reliability growth for numerical control systems.

关 键 词：数控印制电路板 双应力加速寿命试验 加速寿命模型 可靠性 失效分析 

分 类 号：TP114.3[自动化与计算机技术—控制理论与控制工程]