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作 者:王义刚[1,2,1,3] 聂小安[1,2,1,3,4] 常侠[1,2,1,3] 刘振兴[1,2,1,3]
机构地区:[1]中国林业科学研究院林产化学工业研究所 [2]生物质化学利用国家工程实验室 [3]江苏省生物质能源与材料重点实验室,江苏南京210042 [4]中国林业科学研究院林业新技术研究所,北京100091
出 处:《热固性树脂》2014年第1期5-9,共5页Thermosetting Resin
基 金:国家十二五计划(2012BAD32B03);浙江省与中国林业科学研究院省院合作项目(2010SY05)
摘 要:以松香为原料,制备了双组分各向同性导电胶,通过热重分析仪、电子万能实验机和电性能测试等研究了导电胶各组分及及固化条件对其性能的影响。结果表明,松香基双组分导电胶最佳配方为:A组分中DDS改性双酚A环氧树脂,丁基缩水甘油醚,银粉与银包铜粉的质量比为90∶5∶270∶30;B组分中马来海松酸聚酰胺,聚醚胺,PN-23与银粉的质量比为70∶30∶5∶200,A与B组分质量比1∶1,制得的导电胶室温适用期可达6 h,体积电阻率5×10-4Ω·cm,剪切强度(铝合金-铝合金)>10 MPa,200℃热失重0.07%,完全满足200℃以下电子封装应用。The two - component isotropic conductive adhesive was prepared using rosin as raw materials. The effects of each component and curing conditions on the properties of conductive adhesive were investigated by the thermal gravimetric analyzer, electronic universal testing machine and electrical performance testing. The results showed that the best formula of rosin - based two - component conductive adhesive was as followed : A component - mass ratio of DDS modified bisphenol A epoxy resin, butyl glycidyl ether, silver and silver - coated copper powder 90 : 5 : 270 : 30, B component - mass ratio of maleopimaric acid, polyamides, polyether amines, PN - 23 and silver 70 : 30 : 5 : 200, mass ratio of A and B 1 : 1. The pot life at room temperature , volume resistivity , shear strength( aluminum - aluminum) and heat loss at 200 ℃of the prepared conductive was 6 h, 5 ×10^-4Ω·cm, over 10 MPa and 0.07% , respectively. The adhesive could fully meet the electronic packaging applications below 200℃.
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