镀银类导电粉体填料的应用领域和技术现状综述  

Research state of application fields and synthesis technology of Ag-plated conductive fillers

作　　者：郝海娟 

机构地区：[1]爱卡特殊效果颜料(珠海)有限公司广州分公司,广州510060

出　　处：《化工新型材料》2014年第1期164-165,178,共3页New Chemical Materials

摘　　要：随着近十几年来银价的飙升,镀银类导电粉体填料作为较低成本的替代产品越来越受相关行业(尤其是消费电子类)的关注。对目前较为热点的镀银类导电粉体进行应用和技术现状的总结,并初步展望了此类产品的未来发展趋势。As the silver prices soared up dramatically in the past decade, Ag-plated conductive fillers drew more and more attention from relevant industries （particularly consumer electronics） as a cheaper alternative. The applications and synthesis technology of some popular Ag-plated conducnve fillers were summaried, and also provided a preliminary prospect of future development trends of these products.

关 键 词：镀银类导电粉体 消费电子 底材 包覆 

分 类 号：TB383.3[一般工业技术—材料科学与工程]