不锈钢软钎焊用钎料和钎剂的研究  

Study of soldering filler metal and flux for stainless steel

作　　者：周许升[1] 龙伟民[1] 裴夤崟[1] 吕登峰[1] 

机构地区：[1]郑州机械研究所新型钎焊材料与技术国家重点实验室,450001

出　　处：《焊接》2014年第1期26-29,69,共4页Welding & Joining

基　　金：国家高技术研究发展计划"863"项目(2012AA040208)

摘　　要：研究了304不锈钢软钎焊用钎剂和钎料,结果表明:氯化锌+氯化铵+盐酸钎剂可以较好的钎焊不锈钢;Sn-3.5Ag-0.7Cu无铅钎料对不锈钢的润湿性与Sn-Pb钎料相当,Sn-0.7Cu钎料次之,Sn-9Zn的润湿性较差。对Sn基钎料与不锈钢的界面金相分析表明:Sn基钎料与不锈钢的界面形貌较平坦,界面处仅有少量FeSn_2金属间化合物生成,不锈钢软钎焊接头的强度与所采用钎料密切相关。The filler metal and flux for soldering of stainless steel were studied.The results showed that the Sn-Ag-Cu lead- free solder showed the nearly equal wettability on the stainless steel substrate,compared with the commercial Sn-Pb solder.However,the brazed joint with Sn-Ag-Cu lead- free can get higher strength.The joint microstructure consists of FeSn_2 intermetallic compound.The mechanical tests show that the joint strength primarily depends on the strength of solder.

关 键 词：不锈钢 软钎焊 钎料 钎剂 

分 类 号：TG454[金属学及工艺—焊接]