浮选法回收电镀污泥中的铜和镍  

Recycling Copper and Nickel in Electroplating Sludge by Flotation Method

作　　者：胡海娇[1] 刘定富[1] 

机构地区：[1]贵州大学化学与化工学院,贵州贵阳550003

出　　处：《电镀与精饰》2014年第2期42-46,共5页Plating & Finishing

摘　　要：采用氨水-碳酸铵体系浸出电镀污泥中的铜和镍离子,再通过浮选法,以环烷酸作为萃取剂,结合硫酸反萃法,成功回收铜和镍离子,得到只有96.26%铜离子和只有94.31%镍离子的水溶液。同时,通过考察各种方法中不同工艺条件对实验结果的影响,进行实验方案优化。Copper and nickel ions in electroplating sludge were lixiviated in ammonia-ammonium carbon- ate system, then the ions were successfully recovered through flotation method with naphthenic acid as ex- tractant and combination of sulfuric acid stripping method, thus, aqueous solutions which containing only 96.26% of copper ion and containing only 94.31% of nickel ion were obtained respectively. Meanwhile, experimental scheme was optimized by investigating the influences of different process conditions on ex- perimental results in each method.

关 键 词：电镀污泥 浸出 浮选法 反萃 铜和镍 

分 类 号：X703[环境科学与工程—环境工程]