层状粘接结构超声检测信号的同态解卷积脱粘界面定征  

Ultrasonic detection of debond in a multi-layer adhesive structure by homomorphic deconvolution

作　　者：张建生[1] 李明轩[1] 

机构地区：[1]中国科学院声学所,北京100080

出　　处：《应用声学》2001年第1期23-29,共7页Journal of Applied Acoustics

摘　　要：本文利用建立的多层粘接结构超声无损检测信号的卷积模型，推导出了检测信号的解析表达式，并用同态滤波解卷积方法有效地提取出粘接结构的系统响应，进而由其中界面多次反射响应的位置、幅度和包络等特征参数，实现了脱粘二界面（指空气脱粘）的定征和识别．仿真和实验数据的处理结果表明本文方法对脱粘检测的应用有积极的意义。Ultrasonic NDT of interface debond in a multi-layer steel-rubber structure is studied. Based on a simple deconvolution model of multi-layer, the analytic expression of the received echo signal is derived. The characteristics of the second interface debond is extracted by the Homomorphic deconvolution algorithm we developed. Results of both simulation and experiment well indicate the excellence of the method.

关 键 词：脱粘 超声检测 解卷积 同态滤波 检测信号 无损检测材料 多层粘接结构 卷积模型 

分 类 号：TB303[一般工业技术—材料科学与工程] TH878.2[机械工程—仪器科学与技术]