基于ANSYS的板级电路热分析及布局优化设计  

Thermal Analysis of Board-Level Circuit Based on ANSYS and Its Layout Optimization Design

作　　者：马静[1] 

机构地区：[1]淮南联合大学机电系,安徽淮南232001

出　　处：《电子器件》2013年第6期802-805,共4页Chinese Journal of Electron Devices

摘　　要：为了在设计阶段预测电子系统的散热问题,运用ANSYS对板级电路进行建模、加载,得到温度场的分布;通过元器件的布局优化分析得到了合适的布局方案,对比分析了考虑散热措施时的温度场分布;根据分析结果对板级电路热设计时元器件在PCB上的布局提出了合理化建议。In order to predict the heat problem of electronic system in the design stage, by using ANSYS to build and load a board-level circuit model, the temperature field distribution has been obtained. Through the component layout optimization analysis, a suitable scheme emerged with a good performance. The temperature distribution was analysed and contrasted with the cooling measures. According to the analysis of the results of the heat design of board-level circuit, a reasonable proposal of the layout of the components on the PCB was put forward.

关 键 词：板级电路 热分析 布局优化 有限元 

分 类 号：TN41[电子电信—微电子学与固体电子学]