KH550改性氮化硼/氰酸酯树脂导热复合材料的研究  

Study on KH550 modified boron ntride/cyanate ester resin thermal conductive composites

作　　者：赵春宝[1] 苏磊[2] 徐随春[1] 杨绪杰[2] 

机构地区：[1]南京信息职业技术学院微电子学院,南京210046 [2]南京理工大学教育部软化学与功能材料重点实验室,南京210094

出　　处：《化工新型材料》2014年第2期119-121,共3页New Chemical Materials

基　　金：江苏省基础研究计划资助项目(BK2011838);江苏省"333工程"科研项目资助计划(BRA2012119);江苏省"青蓝工程"项目资助(2010)

摘　　要：采用硅烷偶联剂KH550对氮化硼粉末(BN)进行了表面改性,并制备了氰酸酯树脂/氮化硼导热复合材料。研究了BN含量对复合材料的导热性能、电绝缘性能的影响,并运用扫描电子显微镜对材料的断面形貌进行了观察。结果表明:少量BN的加入能有效改善氰酸酯复合材料的导热性能,且复合材料仍保持良好的电绝缘性能。当BN的体积分数达到23.6%时,复合材料的导热系数为1.33W·m-1·K-1,为纯树脂材料的4.6倍。Boron nitride （BN）powder was modified by silane coupling agent KH550,and a series of cyanate ester resin composites containing the modified BN were prepared. The effect of volume fraction of BiN on the thermal conductivi-ty, electrical insulation properties of these composites was investigated. The morphology of fracture surfaces of the compos- ites was also examined by scanning electron microscopy （SEM）. Results showed that addition of a little of BN powder can improve thermal conductivity of the composites effectively, while the composites still retain the relatively good electrical in- sulation. When the volume fraction of BN was 23.6 %, the thermal conductivity of composite increased to 1.33 W/（m · K）, which was 4.6 times that of pure resin.

关 键 词：氰酸酯树脂 氮化硼 导热系数 体积电阻率 介电常数 

分 类 号：TQ320.1[化学工程—合成树脂塑料工业]