湍流模型下堆叠芯片温度场分析  

Temperature field analysis of stacked chip in turbulence model

作　　者：李继生 王婷[2] 黄战武[2] 

机构地区：[1]陕西长岭光伏电气有限公司,陕西宝鸡721006 [2]西安电子科技大学电路CAD研究所,陕西西安710071

出　　处：《现代电子技术》2014年第5期134-136,共3页Modern Electronics Technique

摘　　要：风扇散热的原理是较冷空气流过芯片或PCB板时,通过热对流方法吸收芯片发出的热,变成较热的空气流出,从而达到驱散芯片间热空气的目的。当堆叠在一起的芯片之间有空气匀速流过,且速度v较大时,芯片的散热方式主要是热对流,而热传导、热辐射等散热方式可以忽略不计。通过模拟匀速流动的空气在堆叠芯片中流过的情景,建立了堆叠芯片和匀速流动空气的模型,结合热力学理论,分析了空气流动时板的吸热和温度变化情况,得到了空气匀速流过时堆叠芯片间温度均匀变化的结论,为堆叠芯片的散热提供了理论依据。When colder air flows through Printed Circuit Boards（PCB）,the heat from the chips turns into hotter air and goes away through thermal convection. When hot air flows in a constant velocity through stacked chips,the way of heat dispersing is mostly the heat convection if the velocity is great,and at that time,heat conduction and heat radiation can almost be neglected. A model for stacked chips and moving air with constant velocity is established by imitating. The endothermic condition and tem-perature variation are analyzed with the air flow combines with thermodynamics theory. A conclusion is obtained that the tempera-ture varies linearly when the air velocity is fixed,which provided a theory basis for further research in the heat dissipation among chips.

关 键 词：堆叠芯片 匀速空气流动 热分析 散热 热对流 

分 类 号：TN710-34[电子电信—电路与系统] TP311[自动化与计算机技术—计算机软件与理论]