填充型导热聚酰胺复合材料的研究进展  

Progress in Filled Thermal Conductive Polyamide Composites

作　　者：周海堤[1] 赵凯凯[1] 房嫄 杨小瑞[1] 徐华根[1] 李琛骏[1] 刘引烽[1] 王尹杰 孟成铭 陈晓东 

机构地区：[1]上海大学材料科学与工程学院,上海200444 [2]上海日之升新技术发展有限公司,上海201100

出　　处：《塑料科技》2014年第3期135-139,共5页Plastics Science and Technology

摘　　要：简单介绍了填充型导热复合材料的导热机理,并详细阐述了填充型导热聚酰胺复合材料,从绝缘和非绝缘两个方面概述了国内外学者对导热聚酰胺复合材料的研究进展。最后,对导热塑料今后的发展方向提出了一些想法和展望。The mechanism of filled thermal conductivity of composite materials was briefly introduced, and the filled thermal conductive polyamide composites were expounded in detail. The research progress on thermal conductive polyamide composites at home and abroad from the two aspects of insulation and non-insulation was reviewed. Finally, the future development trend of thermal conductive plastic was prospected.

关 键 词：导热机理 填充改性 聚酰胺复合材料 

分 类 号：TQ323.6[化学工程—合成树脂塑料工业]