双层微通道热沉关键参数的优化  

Optimization of Crucial Parameters for Double-Layer Microchannel Heat Sink

作　　者：林林[1] 陈杨杨[1] 王晓东[2,3] 

机构地区：[1]北京科技大学机械工程学院热能工程系,北京100083 [2]华北电力大学新能源电力系统国家重点实验室,华北电力大学,北京102206 [3]低品位能源多相流与传热北京市重点实验室,华北电力大学,北京102206

出　　处：《工程热物理学报》2014年第3期567-570,共4页Journal of Engineering Thermophysics

基　　金：国家自然科学基金资助(No.51176010);教育部新世纪优秀人才计划(No.NCET-11-0635);中央高校基本科研业务费专项资金(No.12ZX12)

摘　　要：相比于单层热沉,双层热沉显著改善芯片温度均匀性.本文建立了双层热沉的三维流固耦合模型,采用参数递进优化法,对硅基水冷双层热沉的几何结构(流道数N、下层流道高度H_(c1)、上层流道高度H_(c2)和肋条宽度W_r)及上下两层通道的流速比t进行了优化研究.结果表明,在泵功0.2 W和热流密度100 W·cm^(-2)时,最佳的双层热沉结构和通道流速比分别为:N_(opt)=70,H_(c1,opt)=200μm,H_(c2,opt)=650μm,W_(r,opt)=71.48μm和t_(opt)=1.85,相比于同样操作条件和几何参数的单层热沉,热阻降低了11.3%,热沉的最大温差从单层热沉的4.6 K降低到0.5 K,显著改善了热沉的温度均匀性.As compared with single-layer microchannel heat sink （SL-MCHS）, double-layer mi- crochannel heat sink （DL-MCHS） can significantly improve the temperature uniformity of electric elements. This work uses a three-dimensional solid-fluid conjugate model incorporated with a pro- gressive optimization procedure to optimize the cooling performance of a water-cooled, silicon-based DL-MCHS. Four geometric parameters （channel number N, bottom channel height H^I, upper channel height He2, and vertical rib width Wr） and coolant velocity ratio of upper channel to bottom channel, t, are selected as optimized variables. The results show that at a fixed pumping power of 0.05 W and a heat fluxes qw=100 W.cm-2, the optimal geometric structure and coolant velocity ratio for the DL-MCHS are Nopt=70, Hcl,opt=200 ~tm, Hc2,opt：650 btm, Wr,opt=71.48 μm, and topt=1.85. The thermal resistance of the optimal DL-MCHS is reduced by 11.3% compared to the SL-MCHS, and the maximum temperature difference is reduced to 0.5 K, which is far less than 4.2 K of the SL-MCHS.

关 键 词：双层热沉 递进式 温度均匀性 优化 热阻 

分 类 号：TK124[动力工程及工程热物理—工程热物理]