光刻机工件台六自由度超精密位移测量研究  

Research of Plane Wafer Stage's 6-DOF Ultra-precision Displacement Measurement

作　　者：胡金春[1] 高阵雨[2] 成荣[1] 朱煜[1] 

机构地区：[1]清华大学摩擦学国家重点实验室,精密超精密制造装备及控制北京市重点实验室,北京100084 [2]国家自然科学基金委员会计划局,北京100085

出　　处：《中国基础科学》2013年第4期17-20,66,共4页China Basic Science

基　　金：973计划项目(2009CB724205)

摘　　要：工件台是光刻机的核心子系统之一,直接决定了光刻机所能实现的关键尺寸、套刻精度及生产率。六自由度(6-DOF)超精密动态位移测量技术是工件台实现动态精度的关键技术之一,其中多自由度间非线性耦合导致解算误差是其核心科学问题。针对工件台超精密位移精度、快速计算需求,本文介绍了在测量拓扑、解算算法等几个方面开展的研究,提出测量原则、方案及解算方法,解决了6-DOF超精密动态位移中的解算误差问题。Wafer stage is one of the core subsystems of lithog- raphy, which directly determines lithography＇s critical dimension, overlay accuracy and productivity. 6-DOF ultra-precision displacement＇s measurement technique is one of the core techniques for dynamic accuracy＇s a-chievement of wafer stage, in which the computational error caused by multiple DOF＇s nonlinear coupling is one core scientific issue. For the demand of wafer stage＇s ultra-precision displacement＇s accuracy and fast computation, this paper carried out research in the are-as of, and resolved the problem of computational error in 6-DOF ultra-precision dynamic displacements.

关 键 词：6-DOF超精密测量 冗余测量 

分 类 号：TP242.2[自动化与计算机技术—检测技术与自动化装置]