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作 者:周征茂
出 处:《电子元件与材料》2014年第3期77-80,共4页Electronic Components And Materials
摘 要:采用"扎接"工艺,降低了直接锡焊接对电位器电阻温度系数的影响;采用"旋铆"工艺,提高了电位器内部零件的连接可靠性;通过对滑块的受力分析,实现了滑块带动簧片的有效直线运动;通过在绕线骨架上建立电气轨迹的工艺方案设计及利用相关机械结构设计,解决了长方形电位器各个连接部位及其运行的可靠性问题,并验证了其有效性。A creative process of the special joint between terminal and winding tap (mechanical connection then soldering) was put forward for potentiometer producing, which greatly reduced the influence of direct soldering on temperature coefficient of resistors, and another process of rotational riveting was put forward, which improved the connection reliability within the parts in the potentiometer, the linear motion of the sliding block bringing reed was realized by stress analysis. Reliabilities of the connection parts of the potentiometer and its operating are realized by using the mechanical structure design and the design process to establish electrical trace in the bobbin, whose effectiveness is proved by experiments.
关 键 词:长方形线绕电位器 可靠性 扎接 旋铆 工艺方案 机械结构
分 类 号:TN605[电子电信—电路与系统]
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