活性Cu-Ti钎料对Al_2O_3陶瓷润湿性的研究  

Study on Wettability of Cu-Ti Active Filler Metal on Al_2O_3 Ceramics

作　　者：王险峰[1,2] 郑世达[2] 刘凤美[2] 房卫萍[2] 刘立斌[1] 

机构地区：[1]中南大学材料科学与工程学院,湖南长沙410083 [2]广州有色金属研究院广东省现代焊接技术重点实验室,广东广州510650

出　　处：《热加工工艺》2014年第5期13-16,共4页Hot Working Technology

基　　金：广州市科技计划项目(2012J5100046);广东省重点实验室建设项目(2012A061400011)

摘　　要：研究了Ti含量和保温时间对Cu-Ti钎料在Al2O3陶瓷上润湿性的影响。结果表明,保温时间40 min时,Cu-Ti钎料在Al2O3陶瓷上的润湿角最小。随着Ti含量的增加,Cu-Ti钎料在Al2O3陶瓷上的润湿角减小。当Ti含量低于25%时,Cu-Ti钎料对Al2O3陶瓷不浸润。采用电子探针显微镜以及电子能谱仪分析界面的微观结构与成分,分析认为,钎料在陶瓷上的浸润性与活性元素在陶瓷中生成的化合物有关。The effects of Ti content and holding time on the wettability of Cu-Ti filler metal on Al2O3 ceramics were studied. The results show that when the holding time is 40 min, the contact angle of Cu-Ti filler metal with Al2O3 ceramic surface has a minimum value. Increasing Ti content, the contact angle of Cu-Ti filler metal with Al2O3 ceramic surface decreases. When the Ti content is below 25%, Cu-Ti filler metal cannot wet Al2O3 ceramic. The interracial microstructure and composition was observed by SEM and EDS. The results show that the wettability of Cu-Ti filler metal on Al2O3 ceramic surface has relations with active elements generated compounds in the ceramics.

关 键 词：Cu-Ti钎料 润湿性 AL2O3陶瓷 

分 类 号：TG454[金属学及工艺—焊接] TG425