基于半导体制冷的红外特征控制技术初步研究  

Study of controlling infrared exposure of engineering targets based on semiconductor refrigeration

作　　者：佘松林 王吉远 陈玉华 林伟 苏荣华 

机构地区：[1]总参工程兵科研四所,北京100850

出　　处：《防护工程》2014年第1期24-29,共6页Protective Engineering

摘　　要：防护工程与背景的温度差异是导致其在热红外波段暴露的主要原因。本文提出基于半导体制冷的热红外伪装技术，结合多点测温技术与单片机控制技术建立了主动温控系统。通过将温控系统应用于玻璃钢复合材料的实验研究，验证了半导体制冷技术应用于热红外伪装的可行性。结合工程需求，探索了该技术在防热红外侦察监视与成像制导伪装中的应用方法，并编制了相应的单片机程序。Temperature difference between an engineering target and the background is the main reason for its expo-sure in the thermal infrared band. An infrared camouflage technology based on semiconductor refrigeration is pro-posed, in which digital temperature sensor technology, semiconductor refrigeration technology and chip microcom-puter control technology are integrated, and an active temperature control system is established. A glass fiber rein-forced plastic compound material is developed and tested to verify the feasibility of this technology. Finally, the application method of the technology in anti-thermal infrared reconnaissance and surveillance and imaging guidance is presented according to engineering infrared camouflage requirements.

关 键 词：防护工程 热红外伪装 半导体制冷 

分 类 号：V231.3[航空宇航科学与技术—航空宇航推进理论与工程]