添加Ag中间层的镁铝固相连接研究  

Study on Mg-Al solid state bonding with Ag additives as the intermediate layer

作　　者：刘政军[1] 宫颖[1] 苏允海[1] 

机构地区：[1]沈阳工业大学材料科学与工程学院,辽宁沈阳110870

出　　处：《焊接技术》2014年第2期21-23,7,共3页Welding Technology

摘　　要：以AZ31镁合金和纯铝为研究对象,用电子万能压力机对镁和铝添加Ag片进行连接,并用扫描电镜对Mg/Ag/Al接头界面组织结构进行观察和分析,结果表明,Mg/Ag接头界面结合良好,在扩散区形成Mg3Ag和MgAg金属间化合物,Ag/Al接头未形成扩散层。经计算可知,Mg,Ag在各化合物层的扩散系数随加热温度的升高而增大,而且Mg在2种化合物中的扩散迁移能力强于Ag。AZ31 magnesium alloy and pure aluminium was studied in the experiment. The electronic universal pressure machine was utilized to make a bonding between magnesium and aluminium with Ag additives in the middle, and Scanning Electronic Microscope(SEM) was used to detect and analyze the microstructure of the interface of Mg/ Ag/Al welding joints. The results showed that the bonding of the interface was excellent and Mg3Ag inter-metallic compounds were formed in the diffusion zone and no diffusion layer were created in the Ag/Al welding joints. According to the calculation, the diffusion coefficients in each compound layer increased with the increasing temperature and the diffusion ability of magnesium in this two compounds was higher than Ag.

关 键 词：镁合金 铝合金 显微组织 扩散 

分 类 号：TG453.4[金属学及工艺—焊接]