976nm 10W半导体激光器封装与耦合  

Packaging and Coupling Technology of 10W Semiconductor Laser with 976nm Wavelength

作　　者：王志源[1] 孙海东 许留洋[1] 周泽鹏[1] 薄报学[1] 高欣[1] 

机构地区：[1]长春理工大学高功率半导体激光国家重点实验室,长春130022 [2]海特光电有限责任公司,北京102206

出　　处：《长春理工大学学报（自然科学版）》2014年第1期1-5,共5页Journal of Changchun University of Science and Technology(Natural Science Edition)

基　　金：国家自然科学基金项目(61177019;61176048);吉林省科技发展计划项目(20120361)

摘　　要：光纤激光器在国外已经被广泛接受和使用,对相应的泵浦源976nm高功率半导体激光器光纤耦合模块提出了高可靠性的迫切要求。焊接质量直接影响着大功率半导体激光器的可靠性,焊接效果不好会直接导致激光器迅速退化。本文分析了半导体激光器封装热特性,采用Ansys软件对封装结构热特性进行模拟,通过实验与模拟结果对比分析,优化烧结工艺,获得了比较满意的焊装效果;通过理论分析得到高功率半导体激光器的单管耦合方案,最终得到耦合效率为90%的光纤耦合模块。Fiber laser has been widely used abroad, 976nm wavelength fiber coupling semiconductor lasers used as pump sources are required for high power and high reliability operation. Bonding quality has a direct effect on the reli-ability of high power semiconductor lasers,if bonding quality is low it will result in rapid degradation of the packaged device. Firstly,the thermal properties of the laser diode packaging is analyzed by Ansys software. Then after compared and analyzed the results of experiments and simulation,the satisfactory bonding effect is obtained. Finally,a satisfactory bonding result is obtained and an high fiber coupling efficiency of 90% is achieved for the fiber coupling of single emit-ter semiconductor lasers.

关 键 词：高功率半导体激光器 Ansys稳态热分析 应力分析 烧结工艺 Transpro光学设计 

分 类 号：TN29[电子电信—物理电子学]