聚酰亚胺薄膜型电加热回路耐高温试验研究  

Tests for the heat resisting performance of polyimide-film circuit

作　　者：彭方汉[1] 殷亚州 耿利寅[1] 李国强[1] 

机构地区：[1]北京空间飞行器总体设计部空间热控技术北京市重点实验室,北京100094

出　　处：《航天器环境工程》2014年第1期42-46,共5页Spacecraft Environment Engineering

摘　　要：文章以镀锡铜芯导线焊连的聚酰亚胺薄膜型电加热回路为对象,研究了真空环境中不同高温条件下加热回路各组成部分的耐高温能力及其与安装面之间的绝缘性能。试验结果表明:高温条件下加热回路自身不会发生短路现象且回路的耐温上限为350℃,耐温薄弱环节为导线和焊点。最后文章针对加热回路的薄弱环节提出了改进措施,可以使加热回路的耐温上限提升到450℃以上。Tests were carried out on the polyimide-film heater heating circuit with the tinned copper wires. The heat resisting performance of every part of the heating circuit under different high temperature conditions in the vacuum environment was analyzed, including the insulation performance between the circuit and the structure. The test results show that the heating circuit itself will not have a short circuit when the temperate is under 350 ℃. The weak points for the heat resisting are the wires and the welding spots. In the end, the improvements to strengthen the heating circuit＇s heat resisting performance are suggested.

关 键 词：聚酰亚胺薄膜型电加热回路 耐高温性能 试验研究 

分 类 号：TM215.3[一般工业技术—材料科学与工程] TQ323.7[电气工程—电工理论与新技术]