多层印制电路板热设计方法研究  

Research on the Thermal Design Methods for Multilayer PCB

作　　者：彭伟[1] 张根烜[1] 关宏山[1] 张先锋[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所

出　　处：《电子技术（上海）》2014年第2期60-63,共4页Electronic Technology

基　　金：国家安全重大基础研究项目(613164)

摘　　要：电子器件高度集成化导致电路板级散热问题愈发严重,按以往粗放型设计方式无法满足需求。对多层印制电路板(PCB)进行热设计方法的研究,能准确剖析PCB热源演化机制,有助于快速控制其板级温度,提高电路板运行安全性能。通过对某产品波控单机的CPU功能电路板插件进行热设计及仿真分析,结果表明所提方法能够有效降低印制电路板级温度,具有较好的实用性。The highly integration of electronic devices leads to the heat-transfer problem of electronic circuit board layers getting more and more serious. So the former extensive design techniques have not been able to meet the new requirements. The research on the heat design techniques for Multilayer PCB can accurately analyze the evolution mechanism of the heat sources for PCB, so that facilitating the quick control the layer temperature, and improving the security performance of the PCB. On the basis of the thermal design and simulation analysis of the CPU electrocircuit layers for a specific wave-controlled MCU, the results indicate the proposed design technique can effectively cut down the layer temperature, and have better practicability.

关 键 词：印制电路板 热设计 热仿真 

分 类 号：TN41[电子电信—微电子学与固体电子学]