熔渗法制备高导热金刚石/Cu复合材料  

High thermal-conductivity diamond/Cu composites fabricated by infiltration

作　　者：刘楠[1] 黄愿平[1] 刘海彦[1] 杨广宇[1] 荆鹏[1] 李增峰[1] 

机构地区：[1]西北有色金属研究院,西安710016

出　　处：《粉末冶金技术》2014年第1期59-63,共5页Powder Metallurgy Technology

摘　　要：利用真空热压熔渗技术制备金刚石/Cu复合材料.研究熔渗工艺、金刚石表面镀覆条件等对制备出的金刚石/Cu复合材料的热物理性能的影响.通过理论分析和试验数据可以发现：利用熔渗工艺制备出的金刚石/Cu复合材料中增强体金刚石的石墨化程度非常低,对复合材料的热性能影响很小;提高复合材料的致密度以及降低复合材料的界面热阻是提高复合材料热导率的主要方法,通过改变工艺参数和在金刚石表面镀覆金属层等方法可以提高复合材料的致密度并降低材料的界面热阻;采用180 ～ 210μm粒径镀Cr金刚石制备的金刚石体积分数为60％、相对密度为99.1％的复合材料热导率达到462W·m-1· K-1.Diamond/Cu composite was fabricated by pressure infiltration. The effect of infiltration process and plating conditions of diamond particles surface on the thermophysical properties of diamond/Cu composite were investigated. The relative density and interface thermal resistance are two important factors of the thermal conductivity. Improving the relative density and reducing interface thermal resistance are important premises to obtain high thermal- conductivity composite. The relative density of diamond/Cu composite sample contained 60% Cr-coated diamond particles reaches 99. 1% , and its thermal conductivity reaches 462 W·m-1· K-1.

关 键 词：金刚石 CU复合材料 熔渗 热导率 

分 类 号：TQ163[化学工程—高温制品工业]