爆炸压涂制备铜涂层的性能  

Microstructure and properties of copper coating prepared by explosive compaction-coating

作　　者：杜长星[1] 赵铮[1] 陶钢[1] 王金相[2] 

机构地区：[1]南京理工大学能源与动力工程学院,江苏南京210094 [2]南京理工大学瞬态物理重点实验室,江苏南京210094

出　　处：《爆炸与冲击》2014年第1期6-10,共5页Explosion and Shock Waves

基　　金：国家自然科学基金项目(10802038;11272158);中国博士后科学基金项目(2011M500929)~~

摘　　要：利用爆炸压涂技术在铜基板上制备了较大面积的铜涂层,详细阐述了爆炸压涂技术的工艺。利用光学显微镜、扫描电镜观察了铜涂层的微观组织结构,涂层的厚度为280μm,用截线法在涂层的显微结构图上测得其孔隙率为约2%,利用显微硬度计测量了涂层的显微硬度hV0.05=114,还利用能谱分析测量了粉末和涂层中各元素的质量分数,实验前后元素的组成成分基本没有发生变化。爆炸压涂制备的铜涂层具有较好的均匀性和致密性,铜粉末在形成涂层的过程中不会发生氧化现象。The explosive compaction-coating technology was introduced in detail and was used to pre- pare the large-area copper coating. And the surface morphology, element content and thickness of the prepared copper coating were investigated by means of optical microscope, scanning electron microsco- py and energy dispersion spectrum. The porosity of the copper coating was measured by the quantita- tive line method in its SEM photograph. The hardness of the copper coating was observed by a micro- hardness tester. The thickness of the copper coating was 280 μm, the porosity was about 2%, the av- erage microhardness was about 114HV0.05, and the element content remained roughly constant be- fore and after the experiment. The results show that the prepared copper coating has excellent uni- formity and compactness and no oxidation of the copper powder can occur during the process of the copper coating formation.

关 键 词：爆炸力学 孔隙率 爆炸压涂 铜涂层 氧化 

分 类 号：O389[理学—流体力学]