超声振动研磨、抛光法去除激光陀螺腔体深小孔孔壁缺陷技术研究  

Study on Eliminating Disfigurement of Small-deep Holes of the Ring Laser Gyro by Grinding with Ultrasonic Vibration and Polishing

作　　者：崔晓旭[1] 李敏[1] 李大琪[1] 

机构地区：[1]中航工业西安飞行自动控制研究所,陕西西安710065

出　　处：《航空科学技术》2014年第2期73-78,共6页Aeronautical Science & Technology

基　　金：航空科学基金(2010ZE18006)~~

摘　　要：通过对激光陀螺腔体深小孔钻削过程的材料去除机理分析和试验验证,给出了孔壁缺陷的评价方法。研究了某型激光陀螺腔体深小孔钻削过程所产生的孔壁缺陷层深度,并进一步研究了深小孔去除缺陷的工艺,通过超声振动研磨和复合抛光技术,实现了腔体内表面的精密加工。Based on the analysis of the mechanism about wiping material during drilling small-deep holes for the ring laser gyro（RLG） and the corresponding experimental demonstration, the evaluation method of the disifgurement of such deep holes was presented. The depth of the disifgurement layer was investigated, and the craft how to eliminate such disifgurement was also studied. The precise machining of the inner faces of the cavity was achieved by grinding with ultrasonic vibration and combined surface polishing.

关 键 词：超声振动 缺陷层 研磨 抛光 

分 类 号：V241.627[航空宇航科学与技术—飞行器设计]