Residual stress induced wetting variation on electric brush-plated Cu film  

作　　者：孟可可 江月 江忠浩 连建设 蒋青 

机构地区：[1]Key Laboratory of Automobile Materials, Department of Materials Science and Engineering, Jilin University

出　　处：《Chinese Physics B》2014年第3期572-576,共5页中国物理B（英文版）

基　　金：Project supported by the National Natural Science Foundations of China(Grant No.51371089);the Foundation of National Key Basic Research and Development Program of China(Grant No.2010CB 631001)

摘　　要：Nanocrystalline Cu film with a mirror surface finishing is prepared by the electric brush-plating technique. The as- prepared Cu film exhibits a superhydrophilic behavior with an apparent water contact angle smaller than 10°. A subsequent increase in the water contact angle and a final wetting transition from inherent hydrophilicity with water contact angle smaller than 90° to apparent hydrophobicity with water contact angle larger than 90° are observed when the Cu film is subjected to natural aging. Analysis based on the measurement of hardness with nanoindentation and the theory of the bond-order-length-strength correlation reveals that this wetting variation on the Cu film is attributed to the relaxation of residual stress generated during brush-plating deposition and a surface hydrophobization role associated with the broken bond polarization induced by surface nanostructure.Nanocrystalline Cu film with a mirror surface finishing is prepared by the electric brush-plating technique. The as- prepared Cu film exhibits a superhydrophilic behavior with an apparent water contact angle smaller than 10°. A subsequent increase in the water contact angle and a final wetting transition from inherent hydrophilicity with water contact angle smaller than 90° to apparent hydrophobicity with water contact angle larger than 90° are observed when the Cu film is subjected to natural aging. Analysis based on the measurement of hardness with nanoindentation and the theory of the bond-order-length-strength correlation reveals that this wetting variation on the Cu film is attributed to the relaxation of residual stress generated during brush-plating deposition and a surface hydrophobization role associated with the broken bond polarization induced by surface nanostructure.

关 键 词：SUPERHYDROPHILICITY wetting transition residual stress nano indenter 

分 类 号：O484[理学—固体物理]