Iron trichloride as oxidizer in acid slurry for chemical mechanical polishing of Ge_2Sb_2Te_5  

Iron trichloride as oxidizer in acid slurry for chemical mechanical polishing of Ge_2Sb_2Te_5

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作  者:闫未霞 王良咏 张泽芳 刘卫丽 宋志棠 

机构地区:[1]State Key Laboratory of Functional Materials for Informatics, Laboratory of Nanotechnology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences [2]Graduate School of the Chinese Academy of Sciences

出  处:《Chinese Physics B》2014年第4期677-681,共5页中国物理B(英文版)

基  金:Project supported by the National Integrate Circuit Research Program of China(Grant Nos.2011ZX02704-002 and 2009ZX02030-001);the Funds fromthe Science and Technology Council of Shanghai,China(Grant Nos.0952nm00200 and 10QB1403600);the Chinese Academy of Sciences Visiting Professorship for Senior International Scientists

摘  要:The effect of iron trichloride (FeC13) on chemical mechanical polishing (CMP) of Ge2Sb2Te5 (GST) film is inves- tigated in this paper. The polishing rate of GST increases from 38 nm/min to 144 nm/min when the FeC13 concentration changes from 0.01 wt% to 0.15 wt%, which is much faster than 20 nm/min for the 1 wt% H2O2-based slurry. This polish- ing rate trends are inversely correlated with the contact angle data of FeCl3-based slurry on the GST film surface. Thus, it is hypothesized that the hydrophilicity of the GST film surface is associated with the polishing rate during CMP. Atomic force microscope (AFM) and optical microscope (OM) are used to characterize the surface quality after CMP. The chemical mechanism is studied by potentiodynamic measurements such as Ecorr and Icorr to analyze chemical reaction between FeCl3 and GST surface. Finally, it is verified that slurry with FeCl3 has no influence on the electrical property of the post-CMP GST film by the resistivity-temperature (RT) tests.The effect of iron trichloride (FeC13) on chemical mechanical polishing (CMP) of Ge2Sb2Te5 (GST) film is inves- tigated in this paper. The polishing rate of GST increases from 38 nm/min to 144 nm/min when the FeC13 concentration changes from 0.01 wt% to 0.15 wt%, which is much faster than 20 nm/min for the 1 wt% H2O2-based slurry. This polish- ing rate trends are inversely correlated with the contact angle data of FeCl3-based slurry on the GST film surface. Thus, it is hypothesized that the hydrophilicity of the GST film surface is associated with the polishing rate during CMP. Atomic force microscope (AFM) and optical microscope (OM) are used to characterize the surface quality after CMP. The chemical mechanism is studied by potentiodynamic measurements such as Ecorr and Icorr to analyze chemical reaction between FeCl3 and GST surface. Finally, it is verified that slurry with FeCl3 has no influence on the electrical property of the post-CMP GST film by the resistivity-temperature (RT) tests.

关 键 词:chemical mechanical polishing iron trichloride Ge2Sb2Te5 

分 类 号:O482.5[理学—固体物理]

 

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