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作 者:郑爽[1] 徐菁[1] 邱郑富 方琳[1] 孙鑫[1] 陆航[1] 孙莺[1] 胡和丰[1]
机构地区:[1]上海大学材料科学与工程学院,上海200444
出 处:《热固性树脂》2014年第2期10-13,共4页Thermosetting Resin
摘 要:采用非等温动态示差扫描量热法(DSC)和热失重分析法(TGA)研究了N,N,N',N'-四缩水甘油胺-4,4'-双[4-(4-氨基苯氧基)苯基]丙烷/甲基纳迪克酸酐/2-乙基-4-甲基咪唑(TGBAPP/MNA/EMI-24)体系的固化反应过程及固化物的热稳定性。由Kissinger方程和Ozawa方程求得该体系固化反应的表观活化能分别为65.4 kJ/mol和69.0 kJ/mol;由Crane方程求得固化反应近似为一级反应;TGBAPP/MNA/EMI-24体系固化物具有良好的耐热性能,其Tg为226℃,5%,15%和30%的热失重温度分别为312℃,344℃和397℃。The curing reaction of N, N, N', N' - tetraglycidyl -4, 4' - bis(4 - (4 - amino phenyl) phenyl) pro- pane / methyl nadic anhydride/2 - ethyl - 4 - methylimidazole ( TGBAPP/MNA/EMI - 24 ) system and thermal sta- bility of cured product were investigated by dynamic non - isothermal differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The curing apparent activation energy were 65.4 k J/tool and 69.0 kJ/mol cal- culated by the Kissinger and Ozawa method, respectively. The curing reaction was approximately first order reaction obtained by the Crane equation. The cured product of TGBAPP/MNA/EMI -24 system showed good heat resist- ance and the Ts was 226 ℃ , 5% , 15% and 30% mass loss temperature of cured resin were 312 ℃ , 344℃ and 397℃, respectively.
关 键 词:四缩水甘油胺基环氧树脂 甲基纳迪克酸酐 非等温动态DSC 固化行为
分 类 号:TQ323.5[化学工程—合成树脂塑料工业]
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